SUSS MicroTec SE (MDAX/TecDAX: SMHN), a leading supplier of equipment and process solutions for the semiconductor industry, has announced its entry into the wafer-level cleaning market with the launch of the GreenTec Solutions product line and its first system, the GT200. The move expands SUSS' technology portfolio into a market valued at approximately EUR 5.4 billion, driven by advanced packaging, heterogeneous integration, and rising semiconductor demand from AI and high-performance computing applications.
The GreenTec Solutions product line is built on a hybrid cleaning approach that combines proven SUSS technologies TurbulenStrip™ and CrustBuster™ from its Photomask Solutions segment. TurbulenStrip™ uses lower-impact batch soaking and single-wafer handling for efficient resist and residue removal, while CrustBuster™ employs patented in-situ UV technology to break down organic materials directly at the wafer surface. Together, these technologies enable highly efficient residue removal and process stability while reducing chemical consumption and eliminating hazardous acids and organic solvents. This addresses the semiconductor industry's growing environmental, social, and governance (ESG) needs and lowers customers' overall cost of ownership.
The GT200 is specifically designed for research and development, process qualification, and production in 200 mm manufacturing environments for MEMS, RF, Power Device, and CMOS applications. It consolidates photoresist removal, surface activation, and final cleaning in one configurable platform, reducing tool fragmentation and simplifying process flows. SUSS supports customers through joint evaluation programs, process co-development, and recipe optimization to accelerate adoption and de-risk technology transfers ahead of volume production ramps. For more information about the GT200, visit https://www.suss.com/en/products-solutions/greentec-solutions/wafer-cleaning/gt200.
This launch is strategically significant for SUSS as it executes its Ambition 2030 strategy, entering an attractive market with long-term growth potential while leveraging existing expertise. “GreenTec Solutions marks an important milestone in the execution of our Ambition 2030 strategy,” said Burkhardt Frick, CEO of SUSS. “By expanding into wafer-level cleaning, we are entering an attractive market with significant long-term growth potential while leveraging proven technologies and process expertise from our existing portfolio.” The company's differentiated approach combines strong cleaning performance, significantly lower chemical consumption, and the elimination of hazardous acids and organic solvents, creating tangible benefits for customers and positioning SUSS for future growth in advanced semiconductor manufacturing.
SUSS has outlined a clear roadmap toward high-volume manufacturing (HVM). Following the GT200, the company will introduce a dedicated 300 mm HVM platform in 2027, with a 200 mm HVM platform to follow in 2028. This provides customers with a clear migration path from evaluation to full-scale production. “Due to the strong interest from our customers, we are pulling in the launch of a 300 mm HVM solution,” explained Yuta Nagai, Senior Vice President Photomask Solutions at SUSS. The scalable roadmap underscores SUSS' commitment to supporting the next generation of microelectronics with a focus on reliability, innovation, and responsible resource use.
The entry into wafer cleaning represents a significant expansion for SUSS, which has historically focused on photomask processing and other semiconductor equipment. By transferring its proven technologies to wafer-level manufacturing, SUSS is well-positioned to capture share in a growing market. The company's sustainable approach aligns with industry trends toward greener manufacturing, potentially giving it a competitive edge. As the semiconductor industry continues to evolve, SUSS' move into wafer cleaning could enhance its growth prospects and diversify its revenue streams. For more information about SUSS, visit www.suss.com.
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